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Shenzhen Herolaser Equipment Co., Ltd.
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FDA Certificate Laser Cutting System

Shenzhen Herolaser Equipment Co., Ltd.
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FDA Certificate Laser Cutting System

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Brand Name : Herolaser

Model Number : ML-CP-A01-500W

Certification : CE, FDA

Place of Origin : China

MOQ : 1 SET

Price : Negotiable

Payment Terms : T/T, Western Union

Supply Ability : 300 sets/month

Delivery Time : 7-15 days

Packaging Details : Wooden case package: 1500*1600*2000mm/1500 KG

Laser wevelength : 1064 nm

Cooling mode : Water Cooling

Condition : New

Graphic format supported : PLT,DXF,AI,DST,BMP

Application : Laser Cutting

Control software : AutoCAD,Cypcut

Warranty : 2 Years,1 Year

Function : Cutting Engraving Non-metal Materials

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Ceramic Cutting High Precision Laser Cutting Machine Punching Dicing Machine

Model introduction:

Lasers can cut many kinds of ceramic materials. The most common is aluminum silicate (Al2SiO5), which requires complete ablation or copy-break techniques. Each approach has its own advantages based on the requirements of the application.

Unlike other methods, ceramic laser cutting achieves precise thermal control and cuts out detailed patterns. Other advantages include:

  • No contact. Unlike diamond cutting, you don't need to change the saw. The laser can also avoid mechanical stress on the parts.
  • Precise control. The local energy of the laser focus enables very narrow cuts with very small incision widths. Intricate patterns are also possible.
  • No consumables. Unlike water jet cutting, laser cutting does not require additional consumables or disposable materials.
Model features:
  1. Good cutting quality: Due to the small laser spot, high energy density, and fast cutting speed, excellent cutting quality can be obtained.
  2. Narrow kerf: The kerf for laser cutting is generally 0.1-0.2 mm, which saves material.
  3. The cutting edge has good verticality, the cutting surface is smooth without burrs, and the surface roughness is generally controlled above RA:12.5
  4. The heat-affected zone is small. The laser processing has thin slits, fast speed, and concentrated energy. Therefore, the heat transferred to the material to be cut is small, and the deformation of the material is also very small. The width of the heat-affected zone is below 0.05 mm.
  5. Can cut a variety of materials, both metal materials and various non-metal materials
  6. There is no strong radiation, noise and environmental pollution during cutting, creating a good working environment for the health of the operator.

Applied range:
Ceramic substrates, ceramic capacitors, ceramics for sensitive ceramics, ceramic optical fiber connectors and other functional ceramic products; ceramic tools, ceramic bearings, ceramic sealing rings, ceramic spark plugs required by the machinery industry; ceramic rollers for rollers required by the building materials industry; Wear-resistant and corrosion-resistant ceramic parts such as ball valves and cylinder liners required by the petrochemical industry; special ceramic materials required by the national defense industry and ceramic materials used by biologists.
Samples for reference:
FDA Certificate Laser Cutting System
FAQ
1. How is the payment?
  • 30% deposit before production and the balance 70% before shipment
2. How is the delivery and shipment?
  • Ship in 7 days after 100% payment;
  • Plywood box packaging
3. How will you guarantee aftersales services?
  • We offer two warranty for laser source, one year for whole machine and lifetime maintenance services.
  • Engineers available to service machinery overseas
  • Free technical training in our factory
  • Free sample can be sent to you
  • Professional technical team 24 hours online
4. How about your presales service?
  • Speeding offer within 8 hours quick response and free consulting.
  • Free sample cutting or testing is available
  • Progressing solution design to all clients, including distributors and end users.

FDA Certificate Laser Cutting System


Product Tags:

FDA PLT laser cutting system

      

1064nm laser cutting system

      

FDA Silicon Wafer Cutter

      
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